TY - JOUR
T1 - CVD of TixSi1-xO2 films
T2 - Precursor chemistry impacts film composition
AU - Smith, Ryan C.
AU - Hoilien, Noel
AU - Dykstra, Craig
AU - Campbell, Stephen A.
AU - Roberts, Jeffrey T.
AU - Gladfelter, Wayne L.
PY - 2003/3
Y1 - 2003/3
N2 - Thin films of composition TixSi1-xO2 were grown by low-pressure (LP) CVD on silicon (100) substrates using tetraethyl orthosilicate (TEOS), [Si(OC2H5)4], and either titanium isopropoxide (TTIP), [Ti(O-'Pr)4], or anhydrous titanium tetranitrate (TN), [Ti(NO3)4], as the sources of SiO 2 and TiO2, respectively. The substrate temperature was varied between 300 °C and 535 °C, and the individual precursor delivery rates ranged from 5 seem to 100 seem. Under these conditions, growth rates ranging from 0.6 nm min-1 to 90.0 nm min-1 were observed. As-deposited films were amorphous to X-rays, and cross-sectional transmission electron microscopy (TEM) images showed no compositional inhomogeneity. Rutherford backscattering (RBS) spectrometry revealed that the relative concentration of TiO2 and SiO2 was dependent upon the choice of TiO2 precursor. Possible multi-precursor deposition scenarios are presented and discussed in relation to the observed variation of film stoichiometry. For the TTIP-TEOS pair, the systematic variation of Ti content with deposition conditions could be accounted for by a growth scenario that limits SiO2 growth to TiO2 sites within the composite film. For the case of TN-TEOS the Ti content remained close to 50 % for all conditions studied. A specific chemical reaction between TN and TEOS prior to film deposition accounts for the observed composition.
AB - Thin films of composition TixSi1-xO2 were grown by low-pressure (LP) CVD on silicon (100) substrates using tetraethyl orthosilicate (TEOS), [Si(OC2H5)4], and either titanium isopropoxide (TTIP), [Ti(O-'Pr)4], or anhydrous titanium tetranitrate (TN), [Ti(NO3)4], as the sources of SiO 2 and TiO2, respectively. The substrate temperature was varied between 300 °C and 535 °C, and the individual precursor delivery rates ranged from 5 seem to 100 seem. Under these conditions, growth rates ranging from 0.6 nm min-1 to 90.0 nm min-1 were observed. As-deposited films were amorphous to X-rays, and cross-sectional transmission electron microscopy (TEM) images showed no compositional inhomogeneity. Rutherford backscattering (RBS) spectrometry revealed that the relative concentration of TiO2 and SiO2 was dependent upon the choice of TiO2 precursor. Possible multi-precursor deposition scenarios are presented and discussed in relation to the observed variation of film stoichiometry. For the TTIP-TEOS pair, the systematic variation of Ti content with deposition conditions could be accounted for by a growth scenario that limits SiO2 growth to TiO2 sites within the composite film. For the case of TN-TEOS the Ti content remained close to 50 % for all conditions studied. A specific chemical reaction between TN and TEOS prior to film deposition accounts for the observed composition.
KW - Dielectrics
KW - Titanium isopropoxide
KW - Titanium nitrate
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U2 - 10.1002/cvde.200390006
DO - 10.1002/cvde.200390006
M3 - Article
AN - SCOPUS:2142753324
SN - 0948-1907
VL - 9
SP - 79
EP - 86
JO - Chemical Vapor Deposition
JF - Chemical Vapor Deposition
IS - 2
ER -