Design, simulation and fabrication of a bridge structure microtransducer

Ming Zang, Shayne M. Zurn, Dennis L. Polla, Bradley J. Nelson, William P Robbins

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

ANSYS simulation of a variety of microtransducers was performed. The results indicate that a bridge structure is an optimal design for a microtransducer. Simulation of a bridge structure PZT thin film microtransducer was verified by fabricating the device on silicon wafers using reactive ion etching (RIE) and bulk micromachining techniques. The bridge of the microtransducer is released by back etching of the silicon wafer using an STS RIE system. One advantage of the STS RIE system is that is allows more than six wafers to be etched at one time, as opposed to deep trench RIE systems. The complexity of the fabrication process is also greatly reduced using this combination of processes. Analytical results of the frequency response closely agree with experimental results. Testing and simulation verified that the bridge structure PZT thin film transducer is more sensitive than other structures, such as membranes, cantilever beams and sandwich structures. The bridge transducer has a Q factor of 500.

Original languageEnglish (US)
Title of host publication2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
EditorsM. Laudon, B. Romanowicz
Pages265-268
Number of pages4
StatePublished - Dec 1 2000
Event2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000 - San Diego, CA, United States
Duration: Mar 27 2000Mar 29 2000

Publication series

Name2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000

Other

Other2000 International Conference on Modeling and Simulation of Microsystems - MSM 2000
CountryUnited States
CitySan Diego, CA
Period3/27/003/29/00

Keywords

  • And Deep trench RIE
  • Microsensor
  • Microtransducer
  • PZT thin film
  • PZT thin film bridge

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