Abstract
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal placement method presented in this paper uses an iterative force-directed approach in which thermal forces direct cells away from areas of high temperature. Finite element analysis (FEA) is used to calculate temperatures efficiently during each iteration. Benchmark circuits produce thermal placements with both lower temperatures and thermal gradients while wirelength is minimally affected.
| Original language | English (US) |
|---|---|
| Title of host publication | IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers |
| Pages | 86-89 |
| Number of pages | 4 |
| State | Published - 2003 |
| Event | IEEE/ACM International Conference on Computer Aided Design ICCAD 2003: IEEE/ACM Digest of Technical Papers - San Jose, CA, United States Duration: Nov 9 2003 → Nov 13 2003 |
Other
| Other | IEEE/ACM International Conference on Computer Aided Design ICCAD 2003: IEEE/ACM Digest of Technical Papers |
|---|---|
| Country/Territory | United States |
| City | San Jose, CA |
| Period | 11/9/03 → 11/13/03 |