Fast spintronic thermal sensor for IC power driver cooling down

Yanfeng Jiang; Yisong Zhang; Angeline Klemm; Jianping Wang

doi:10.1109/IEDM.2016.7838483

Fast spintronic thermal sensor for IC power driver cooling down

Yanfeng Jiang, Yisong Zhang, Angeline Klemm, Jianping Wang

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

A novel thermal sensor is designed and fabricated based on spin-transfer torque operated magnetic tunnel junction (STT-MTJ) device. It can fulfill thermal detection and overheat protection on integrated circuit. Moreover, it shows over 10 times faster thermal transit response speed than that of traditional CMOS thermal sensor. The unique property is really helpful for controlling integrated circuit's temperature due to heating by leakage current. A power driver at full loading situation is used to demonstrate this design. It shows that the sensor can be adopted as adaptive manner in a power source scaling strategy to cool down the IC in an effective way, showing a promising potential application not only as discrete sensor, but also as power solution for IC driver.

Original language	English (US)
Title of host publication	2016 IEEE International Electron Devices Meeting, IEDM 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	26.2.1-26.2.4
ISBN (Electronic)	9781509039012
DOIs	https://doi.org/10.1109/IEDM.2016.7838483
State	Published - Jan 31 2017
Event	62nd IEEE International Electron Devices Meeting, IEDM 2016 - San Francisco, United States Duration: Dec 3 2016 → Dec 7 2016

Publication series

Name	Technical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)	0163-1918

Other

Other	62nd IEEE International Electron Devices Meeting, IEDM 2016
Country/Territory	United States
City	San Francisco
Period	12/3/16 → 12/7/16

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Publisher Copyright:
© 2016 IEEE.

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10.1109/IEDM.2016.7838483

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Jiang, Y., Zhang, Y., Klemm, A., & Wang, J. (2017). Fast spintronic thermal sensor for IC power driver cooling down. In 2016 IEEE International Electron Devices Meeting, IEDM 2016 (pp. 26.2.1-26.2.4). Article 7838483 (Technical Digest - International Electron Devices Meeting, IEDM). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEDM.2016.7838483

Fast spintronic thermal sensor for IC power driver cooling down. / Jiang, Yanfeng; Zhang, Yisong; Klemm, Angeline et al.
2016 IEEE International Electron Devices Meeting, IEDM 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 26.2.1-26.2.4 7838483 (Technical Digest - International Electron Devices Meeting, IEDM).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Jiang, Y, Zhang, Y, Klemm, A & Wang, J 2017, Fast spintronic thermal sensor for IC power driver cooling down. in 2016 IEEE International Electron Devices Meeting, IEDM 2016., 7838483, Technical Digest - International Electron Devices Meeting, IEDM, Institute of Electrical and Electronics Engineers Inc., pp. 26.2.1-26.2.4, 62nd IEEE International Electron Devices Meeting, IEDM 2016, San Francisco, United States, 12/3/16. https://doi.org/10.1109/IEDM.2016.7838483

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Fast spintronic thermal sensor for IC power driver cooling down

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