Fluidic self-assembly of InGaAs vertical cavity surface emitting lasers onto silicon

J. K. Tu, J. J. Talghader, J. S. Smith, M. A. Hadley

Research output: Contribution to journalArticlepeer-review

39 Scopus citations

Abstract

Vertical cavity surface emitting lasers (VCSELs) have been successfully integrated by fluidic self-assembly (FSA) into 10 μm deep holes etched into an Si substrate. These 40 × 40 × 10 μm3 devices were fully planarised and metallised after integration. The VCSELs operated pulsed at 0.98 μm with a threshold current as low as 75mA and a turn-on voltage of 2.9V.

Original languageEnglish (US)
Pages (from-to)1448-1449
Number of pages2
JournalElectronics Letters
Volume31
Issue number17
DOIs
StatePublished - Aug 17 1995

Keywords

  • Packaging
  • Vertical cavity surface emitting lasers

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