Mathematically assisted adaptive body bias (ABB) for temperature compensation in gigascale LSI systems

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Scopus citations

Abstract

Process variations and temperature variations can cause both the frequency and the leakage of the chip to vary significantly from their expected values, thereby decreasing the yield. Adaptive Body Bias (ABB) can be used to pull back the chip to the nominal operational region. We propose the use of this technique to counter temperature variations along with process variations. We present a CAD perspective for achieving process and temperature compensation using bidirectional ABB. Mathematical models are used to determine the exact amount of body bias required to optimize the delay and leakage, and an algorithmic flow that can be adopted for gigascale LSI systems is provided.

Original languageEnglish (US)
Title of host publicationProceedings of the ASP-DAC 2006
Subtitle of host publicationAsia and South Pacific Design Automation Conference 2006
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages559-564
Number of pages6
ISBN (Print)0780394518, 9780780394513
DOIs
StatePublished - 2006
EventASP-DAC 2006: Asia and South Pacific Design Automation Conference 2006 - Yokohama, Japan
Duration: Jan 24 2006Jan 27 2006

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
Volume2006

Other

OtherASP-DAC 2006: Asia and South Pacific Design Automation Conference 2006
CountryJapan
CityYokohama
Period1/24/061/27/06

Keywords

  • Adaptive Body Bias (ABB)
  • Delay
  • Enumeration
  • Leakage
  • Nonlinear Programming Problem (NLPP)
  • Process Variations
  • Temperature Variations

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