Measurement, analysis and improvement of supply noise in 3D ICs

Pulkit Jain; Dong Jiao; Xiaofei Wang; Chris H. Kim

Measurement, analysis and improvement of supply noise in 3D ICs

Pulkit Jain, Dong Jiao, Xiaofei Wang, Chris H. Kim

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

9 Scopus citations

Abstract

Supply noise measurements from a 3D IC have been presented for the first time. IR noise rather than Ldi/dt noise is shown to be dominant due to the fewer supply pins and the additional resistance from the through-silicon vias (TSVs). Kelvin probing for IR noise reveals that the effect of pins is significantly more than TSVs. A novel multi-story power delivery is demonstrated for a 393kb SRAM suppressing the IR noise by 30-70%.

Original language	English (US)
Title of host publication	2011 Symposium on VLSI Circuits, VLSIC 2011 - Digest of Technical Papers
Pages	46-47
Number of pages	2
State	Published - Sep 16 2011
Event	2011 Symposium on VLSI Circuits, VLSIC 2011 - Kyoto, Japan Duration: Jun 15 2011 → Jun 17 2011

Other

Other	2011 Symposium on VLSI Circuits, VLSIC 2011
Country/Territory	Japan
City	Kyoto
Period	6/15/11 → 6/17/11

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@inproceedings{e4bcd82fbb8d48c9a8ebec7d9fd6e5e7,

title = "Measurement, analysis and improvement of supply noise in 3D ICs",

abstract = "Supply noise measurements from a 3D IC have been presented for the first time. IR noise rather than Ldi/dt noise is shown to be dominant due to the fewer supply pins and the additional resistance from the through-silicon vias (TSVs). Kelvin probing for IR noise reveals that the effect of pins is significantly more than TSVs. A novel multi-story power delivery is demonstrated for a 393kb SRAM suppressing the IR noise by 30-70%.",

author = "Pulkit Jain and Dong Jiao and Xiaofei Wang and Kim, {Chris H.}",

year = "2011",

month = sep,

day = "16",

language = "English (US)",

isbn = "9784863481657",

pages = "46--47",

booktitle = "2011 Symposium on VLSI Circuits, VLSIC 2011 - Digest of Technical Papers",

note = "2011 Symposium on VLSI Circuits, VLSIC 2011 ; Conference date: 15-06-2011 Through 17-06-2011",

}

TY - GEN

T1 - Measurement, analysis and improvement of supply noise in 3D ICs

AU - Jain, Pulkit

AU - Jiao, Dong

AU - Wang, Xiaofei

AU - Kim, Chris H.

PY - 2011/9/16

Y1 - 2011/9/16

N2 - Supply noise measurements from a 3D IC have been presented for the first time. IR noise rather than Ldi/dt noise is shown to be dominant due to the fewer supply pins and the additional resistance from the through-silicon vias (TSVs). Kelvin probing for IR noise reveals that the effect of pins is significantly more than TSVs. A novel multi-story power delivery is demonstrated for a 393kb SRAM suppressing the IR noise by 30-70%.

AB - Supply noise measurements from a 3D IC have been presented for the first time. IR noise rather than Ldi/dt noise is shown to be dominant due to the fewer supply pins and the additional resistance from the through-silicon vias (TSVs). Kelvin probing for IR noise reveals that the effect of pins is significantly more than TSVs. A novel multi-story power delivery is demonstrated for a 393kb SRAM suppressing the IR noise by 30-70%.

UR - http://www.scopus.com/inward/record.url?scp=80052647818&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=80052647818&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:80052647818

SN - 9784863481657

SP - 46

EP - 47

BT - 2011 Symposium on VLSI Circuits, VLSIC 2011 - Digest of Technical Papers

T2 - 2011 Symposium on VLSI Circuits, VLSIC 2011

Y2 - 15 June 2011 through 17 June 2011

ER -

Measurement, analysis and improvement of supply noise in 3D ICs

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