Measurement, analysis and improvement of supply noise in 3D ICs

Pulkit Jain, Dong Jiao, Xiaofei Wang, Chris H. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

Supply noise measurements from a 3D IC have been presented for the first time. IR noise rather than Ldi/dt noise is shown to be dominant due to the fewer supply pins and the additional resistance from the through-silicon vias (TSVs). Kelvin probing for IR noise reveals that the effect of pins is significantly more than TSVs. A novel multi-story power delivery is demonstrated for a 393kb SRAM suppressing the IR noise by 30-70%.

Original languageEnglish (US)
Title of host publication2011 Symposium on VLSI Circuits, VLSIC 2011 - Digest of Technical Papers
Pages46-47
Number of pages2
StatePublished - Sep 16 2011
Event2011 Symposium on VLSI Circuits, VLSIC 2011 - Kyoto, Japan
Duration: Jun 15 2011Jun 17 2011

Other

Other2011 Symposium on VLSI Circuits, VLSIC 2011
CountryJapan
CityKyoto
Period6/15/116/17/11

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