The effect of design and process parameters on electromechanical coupling for a thin-film PZT membrane

Omar Al-Hattamleh; Jeong Cho; Robert F. Richards; David F. Bahr; Cecilia D. Richards

doi:10.1109/JMEMS.2006.883575

The effect of design and process parameters on electromechanical coupling for a thin-film PZT membrane

Omar Al-Hattamleh, Jeong Cho, Robert F. Richards, David F. Bahr, Cecilia D. Richards

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Abstract

In this paper, a finite-element model is used to analyze the performance of a thin-film piezoelectric laminate for power generation applications. The focus is on the effects of residual stress, the ratio of PZT to substrate thickness, the substrate material, electrode coverage, boundary conditions, and side length on the electromechanical coupling coefficient. The results show that the residual stress has the most substantial effect on the electromechanical coupling coefficient and should be minimized to increase the electromechanical coupling. Attention to other design parameters can be used to further optimize electromechanical coupling. Electrode coverage should be kept close to 50%. For Si substrates, a Si/PZT ratio of 4 maximizes the electromechanical coupling coefficient. Substrates with higher stiffness lead to superior electromechanical coupling. The results show that design changes, which lead to increased electromechanical coupling, also lead to greater efficiency.

Original language	English (US)
Pages (from-to)	1715-1725
Number of pages	11
Journal	Journal of Microelectromechanical Systems
Volume	15
Issue number	6
DOIs	https://doi.org/10.1109/JMEMS.2006.883575
State	Published - Dec 2006
Externally published	Yes

Bibliographical note

Funding Information:
Manuscript received September 20, 2005; revised June 26, 2006. This work was supported by DARPA MTO’s MicroPower Generation Program and the U.S. Army SMDC under Contract DASG60-02-C0001. Subject Editor C. Liu. The authors are with the School of Mechanical and Materials Engineering, Washington State University, Pullman, WA 99164 USA (e-mail: cill@wsu.edu). Color versions of Figs. 1, 3, 5, 6, 8–10 available at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/JMEMS.2006.883575

Keywords

Electromechanical coupling
MEMS power generation
PZT
Piezoelectric energy conversion

Access

10.1109/JMEMS.2006.883575

OpenUrl availability

Full text

Cite this

@article{ae2051bbbe244d56b36542f5f27e9f96,

title = "The effect of design and process parameters on electromechanical coupling for a thin-film PZT membrane",

abstract = "In this paper, a finite-element model is used to analyze the performance of a thin-film piezoelectric laminate for power generation applications. The focus is on the effects of residual stress, the ratio of PZT to substrate thickness, the substrate material, electrode coverage, boundary conditions, and side length on the electromechanical coupling coefficient. The results show that the residual stress has the most substantial effect on the electromechanical coupling coefficient and should be minimized to increase the electromechanical coupling. Attention to other design parameters can be used to further optimize electromechanical coupling. Electrode coverage should be kept close to 50%. For Si substrates, a Si/PZT ratio of 4 maximizes the electromechanical coupling coefficient. Substrates with higher stiffness lead to superior electromechanical coupling. The results show that design changes, which lead to increased electromechanical coupling, also lead to greater efficiency.",

keywords = "Electromechanical coupling, MEMS power generation, PZT, Piezoelectric energy conversion",

author = "Omar Al-Hattamleh and Jeong Cho and Richards, {Robert F.} and Bahr, {David F.} and Richards, {Cecilia D.}",

note = "Funding Information: Manuscript received September 20, 2005; revised June 26, 2006. This work was supported by DARPA MTO{\textquoteright}s MicroPower Generation Program and the U.S. Army SMDC under Contract DASG60-02-C0001. Subject Editor C. Liu. The authors are with the School of Mechanical and Materials Engineering, Washington State University, Pullman, WA 99164 USA (e-mail: cill@wsu.edu). Color versions of Figs. 1, 3, 5, 6, 8–10 available at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/JMEMS.2006.883575",

year = "2006",

month = dec,

doi = "10.1109/JMEMS.2006.883575",

language = "English (US)",

volume = "15",

pages = "1715--1725",

journal = "Journal of Microelectromechanical Systems",

issn = "1057-7157",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "6",

}

TY - JOUR

T1 - The effect of design and process parameters on electromechanical coupling for a thin-film PZT membrane

AU - Al-Hattamleh, Omar

AU - Cho, Jeong

AU - Richards, Robert F.

AU - Bahr, David F.

AU - Richards, Cecilia D.

N1 - Funding Information: Manuscript received September 20, 2005; revised June 26, 2006. This work was supported by DARPA MTO’s MicroPower Generation Program and the U.S. Army SMDC under Contract DASG60-02-C0001. Subject Editor C. Liu. The authors are with the School of Mechanical and Materials Engineering, Washington State University, Pullman, WA 99164 USA (e-mail: cill@wsu.edu). Color versions of Figs. 1, 3, 5, 6, 8–10 available at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/JMEMS.2006.883575

PY - 2006/12

Y1 - 2006/12

N2 - In this paper, a finite-element model is used to analyze the performance of a thin-film piezoelectric laminate for power generation applications. The focus is on the effects of residual stress, the ratio of PZT to substrate thickness, the substrate material, electrode coverage, boundary conditions, and side length on the electromechanical coupling coefficient. The results show that the residual stress has the most substantial effect on the electromechanical coupling coefficient and should be minimized to increase the electromechanical coupling. Attention to other design parameters can be used to further optimize electromechanical coupling. Electrode coverage should be kept close to 50%. For Si substrates, a Si/PZT ratio of 4 maximizes the electromechanical coupling coefficient. Substrates with higher stiffness lead to superior electromechanical coupling. The results show that design changes, which lead to increased electromechanical coupling, also lead to greater efficiency.

AB - In this paper, a finite-element model is used to analyze the performance of a thin-film piezoelectric laminate for power generation applications. The focus is on the effects of residual stress, the ratio of PZT to substrate thickness, the substrate material, electrode coverage, boundary conditions, and side length on the electromechanical coupling coefficient. The results show that the residual stress has the most substantial effect on the electromechanical coupling coefficient and should be minimized to increase the electromechanical coupling. Attention to other design parameters can be used to further optimize electromechanical coupling. Electrode coverage should be kept close to 50%. For Si substrates, a Si/PZT ratio of 4 maximizes the electromechanical coupling coefficient. Substrates with higher stiffness lead to superior electromechanical coupling. The results show that design changes, which lead to increased electromechanical coupling, also lead to greater efficiency.

KW - Electromechanical coupling

KW - MEMS power generation

KW - PZT

KW - Piezoelectric energy conversion

UR - http://www.scopus.com/inward/record.url?scp=33845533160&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33845533160&partnerID=8YFLogxK

U2 - 10.1109/JMEMS.2006.883575

DO - 10.1109/JMEMS.2006.883575

M3 - Article

AN - SCOPUS:33845533160

SN - 1057-7157

VL - 15

SP - 1715

EP - 1725

JO - Journal of Microelectromechanical Systems

JF - Journal of Microelectromechanical Systems

IS - 6

ER -

The effect of design and process parameters on electromechanical coupling for a thin-film PZT membrane

Abstract

Bibliographical note

Keywords

Access

OpenUrl availability

Other files and links

Fingerprint

Cite this