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SOI wafer mold with high-aspect-ratio microstructures for hot embossing process
Y. Zhao,
T. Cui
Mechanical Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
4
Scopus citations
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Dive into the research topics of 'SOI wafer mold with high-aspect-ratio microstructures for hot embossing process'. Together they form a unique fingerprint.
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Physics & Astronomy
embossing
92%
high aspect ratio
73%
oils
61%
etching
51%
wafers
51%
insulators
50%
microstructure
40%
silicon
36%
thin walls
22%
inserts
19%
aspect ratio
15%
Chemical Compounds
Embossing
100%
Nonconductor
76%
Etching
61%
Microstructure
45%
Surface
5%
Engineering & Materials Science
Etching
73%
Aspect ratio
63%
Silicon
53%
Microstructure
45%
Oils
44%